Appearance Inspection Requirements for Integrated Circuit (CHI - ENG) 我们为某国家级实验室提供技术类翻译（中译英），翻译内容：集成电路外观检查要求。
4.4 Protection requirements for devices during appearance inspection
a) Anti-static measures must be taken during appearance inspection.
b) Fingerstall must be worn when touching the devices.
c) The original package of devices must not be changed during appearance inspection. After the completion of the device inspection, the package shall be restored to its original state, and the direction of signs of upper and lower packaging shall be noticed.
d) Handle devices gently during appearance inspection, and prevent the fall, bruise, scratch, shake or wear of devices.
4.5 Environmental conditions for appearance inspection
Unless otherwise specified, the laboratory environment for appearance inspection shall meet the following conditions: Temperature: 20 °C to 28 °C, relative humidity: 30% to 70%.
4.6 Test implementation
4.6.1 Device packaging inspection
Inspect whether the packaging of devices and the direction of packing box are correct. After confirming that the package is intact and proper, appearance inspection of devices can be started.
4.6.2 Check the device to undergo appearance inspection
Open the package on the operating platform according to the direction of the device’s package sign. Check the device whose appearance is to be inspected and confirm that the model, lot number and quantity of the device are consistent with the operation list.
4.6.3 Appearance inspection
On the special operating platform for arrival inspection, one device is taken out for appearance inspection under the optical microscope each time. In the event of a failure judgment (see Section 4), then the device is judged to be a non-conforming product in appearance inspection. When finding that the appearance of one device is abnormal or that of multiple devices is defective, fill out the screening problem report.